Specific Process Knowledge/Wafer cleaning/cleaning with HF: Difference between revisions

Latest revision as of 16:21, 10 June 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.

Feedback to this page: click here

Removal of native oxide is a part of the RCA cleaning procedure. See the RCA page for further details. The HF/BHF baths in the RCA bench bath must only be used during the RCA cleaning procedure. For removal of oxide of processed wafers that is not getting a full RCA clean the other HF/BHF baths can be used. Please see the oxide etch page for more details.

Revision as of 12:56, 13 February 2023 view source Mbec (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 186 edits No edit summary ← Older edit		Latest revision as of 16:21, 10 June 2025 view source Mmat (talk \| contribs) NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators 1,954 edits mNo edit summary
Line 1:		Line 1:
	~~'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''~~		{{cc-nanolab}}

	'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''		'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''