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Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures: Difference between revisions

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{|
{|
| [[Image:DREM2pic1.jpg |thumb|x300px|200nm trenches etched with 100 cycles (cross section view), a smooth sidewall can be seen with less scallop induced roughness]]
| [[Image:DREM2pic1.jpg |thumb|x300px|200nm trenches etched with 100 cycles (cross section view), a smooth sidewall can be seen with less scallop induced roughness]]
| [[Image:DREM2pic2.jpg |frame|x300px|200nm pillars etched with 100 cycles (cross section view)]]
| [[Image:DREM2pic2.jpg |thumb|x300px|200nm pillars etched with 100 cycles (cross section view)]]
|-
|-
| [[Image:DREM2pic3.jpg |thumb|x300px|200nm pillars etched with 100 cycles (tilted view)]]
| [[Image:DREM2pic3.jpg |thumb|x300px|200nm pillars etched with 100 cycles (tilted view)]]