Specific Process Knowledge/Bonding/Imprinter 02: Difference between revisions
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The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds [[Specific Process Knowledge/Bonding|bonding]] can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces. | The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds [[Specific Process Knowledge/Bonding|bonding]] can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces. | ||
'''The user manual, quality control procedure and results, user APV(s), and contact information can be found | '''The user manual, quality control procedure and results, user APV(s), and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=401| LabManager]. | ||
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