Specific Process Knowledge/Bonding/Imprinter 02: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]''' | ||
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The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds [[Specific Process Knowledge/Bonding|bonding]] can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces. | The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds [[Specific Process Knowledge/Bonding|bonding]] can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces. | ||