Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions
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* chromium | * chromium | ||
Over time it is our intention to add other materials to the list such as molybdenum, tungsten, titaniumtungsten, titaniumoxides or piezo-materials such as ZnO. However, currently you are not even allowed to expose other metals to the plasma. | Over time it is our intention to add other materials to the list such as molybdenum, tungsten, titaniumtungsten, titaniumoxides or piezo-materials such as ZnO. However, currently you are not even allowed to expose other metals to the plasma. | ||
=== Aluminium etch === | |||
The aluminium etch has two steps: | |||
: Breakthrough | |||
; The breakthrough is designed to break through the native aluminium oxide layer that is present on all aluminium surfaces. | |||
==Etching of nanostructures in silicon using the ICP Metal Etcher or DRIE Pegasus== | ==Etching of nanostructures in silicon using the ICP Metal Etcher or DRIE Pegasus== | ||