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==General Purpose Annealing furnace (C2)==
==General Purpose Annealing furnace (C2)==


The C2 furnace has fromt September 2024 become a general purpose Annealing furnace. It means that it can be used for annealing of different samples and different materials.   
The General Purpose Annealing furnace (C2) is a Tempress horizontal furnace located in the furnace C stack.
 
The C2 furnace has from September 2024 become a general purpose annealing furnace. It means that it can be used for annealing of different samples and different materials, such as silicon substrates with metal layers. 
 
A permission from the Thin Film group is required, before samples are annealed in the furnace.   
 
An annealing temperature of maximum 600 C is allowed in the furnace, with a ramp rate of up to 10°C/min. The standby temperature is set to 250°C.
 
Annealings can be performed in a nitrogen atmosphere, with nitrogen flow rates adjustable up to 10 SLM.


A permission from the Thin Film group is required, before samples are annealed in the furnace.   
A permission from the Thin Film group is required, before samples are annealed in the furnace.   


III-V Oxidaiont furnace (C2) is being used on August 2019 for wet oxidation of III-V devices instead of [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=187 III-V Oven (D4)], for instance for lateral oxidation of thin AlGaAs layers to defined apertures in light-limiting diodes.  
Please also check the cross contamination information in LabManager before you use the furnace.  


The furnace is a Tempress horizontal furnace. A Sample is placed on the carrier quartz plate, which always be kept inside the furnace tube, and loaded to the hot furnace that filling with water vapour. The sample get oxidized at the desired time and then the furnace door will automatically open so that the oxidation stops and the sample is ready to be unloaded.
The furnace is a Tempress horizontal furnace. A Sample is placed on the carrier quartz plate, which always be kept inside the furnace tube, and loaded to the hot furnace that filling with water vapour. The sample get oxidized at the desired time and then the furnace door will automatically open so that the oxidation stops and the sample is ready to be unloaded.
    
    
Before use, samples have to be cleaned. A short BHF dip can be used to remove any native oxide which can be difficult to penetrate by a wet thermal oxidation.
Please check the cross contamination information in LabManager before you use the furnace.


'''The user manual and contact information can be found in LabManager:'''
'''The user manual and contact information can be found in LabManager:'''
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thermal_Process/C2_Furnace_III-V_oxidation"