Specific Process Knowledge/Process Flow: Difference between revisions
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Even if some of these methods are fast and cheap to perform, not all information might be relevant for the fabrication of your device taking up unnecessary resources. It is, therefore, vital to chose methods relevant for you process and product. Please do not hesitate to reach out to our Fabrication Support team at [mailto:nanolabsupport@nanolab.dtu.dk nanolabsupport@nanolab.dtu.dk]. | Even if some of these methods are fast and cheap to perform, not all information might be relevant for the fabrication of your device taking up unnecessary resources. It is, therefore, vital to chose methods relevant for you process and product. Please do not hesitate to reach out to our Fabrication Support team at [mailto:nanolabsupport@nanolab.dtu.dk nanolabsupport@nanolab.dtu.dk]. | ||
=== Surface Toppography === | |||
Surface Toppography | ''Analysis of form, shape, size, structure, and surface features including surface roughness, f.ex'' | ||
Analysis of form, shape, size, structure, and surface features including surface roughness, f.ex | |||
* Light microscopy | * Light microscopy | ||
* Electron beam microscopy: SEM; TEM | * Electron beam microscopy: SEM; TEM | ||
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* Particle Scanner | * Particle Scanner | ||
Chemical Composition and Molecular Interaction | === Chemical Composition and Molecular Interaction === | ||
''Techniques to identify elemental composition and chemical states, as well as the interaction between molecules, f.ex.'' | |||
Techniques to identify elemental composition and chemical states, as well as the interaction between molecules, f.ex. | |||
* EDS/EDX (Energy Dispersive X-ray Spectroscopy) | * EDS/EDX (Energy Dispersive X-ray Spectroscopy) | ||
* XPS (X-ray Photoelectron Spectroscopy) | * XPS (X-ray Photoelectron Spectroscopy) | ||
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* Raman Spectroscopy - not available at DTU Nanolab | * Raman Spectroscopy - not available at DTU Nanolab | ||
Optical Properties | === Optical Properties === | ||
''Analysis of optical properties such as film thickness, optical constants (refractive index, extinction coefficient), reflectivity, and others, f.ex.'' | |||
Analysis of optical properties such as film thickness, optical constants (refractive index, extinction coefficient), reflectivity, and others. | |||
* Ellipsometry | * Ellipsometry | ||
*Spectrophotometry | *Spectrophotometry | ||
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*PhotoLuminescence Mapper | *PhotoLuminescence Mapper | ||
Mechanical Properties | === Mechanical Properties === | ||
Techniques to measure hardness, elasticity, and stress. | ''Techniques to measure hardness, elasticity, and stress, f.ex.'' | ||
*Stylus profilometer | *Stylus profilometer | ||
*Hardness tester | *Hardness tester | ||
*AFM | *AFM | ||
Electrical Properties | === Electrical Properties === | ||
''Techniques to evaluate conductivity, resistivity, and carrier behavior, f.ex.'' | |||
*4-Point Probe, Probe station | *4-Point Probe, Probe station | ||
*III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler) | *III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler) | ||
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*AFM | *AFM | ||
Others | === Others === | ||
* Thermal Properties | * Thermal Properties | ||
* Magnetic Properties | * Magnetic Properties | ||