Specific Process Knowledge/Process Flow: Difference between revisions

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+Surface Toppography
+Analysis of form, shape, size, structure, and surface features including surface roughness, f.ex
+* Light microscopy
+* Electron beam microscopy: SEM; TEM
+* AFM
+* Optical or mechanical profilometer
+* Particle Scanner
+Chemical Composition and Molecular Interaction
+Techniques to identify elemental composition and chemical states, as well as the interaction between molecules, f.ex.
+* EDS/EDX (Energy Dispersive X-ray Spectroscopy)
+* XPS (X-ray Photoelectron Spectroscopy)
+* XRD (X-ray diffraction)
+* Contact Angle Measurement
+* SIMS (Secondary Ion Mass Spectrometry) – not available at DTU Nanolab
+* Raman Spectroscopy - not available at DTU Nanolab
+Optical Properties
+Analysis of optical properties such as film thickness, optical constants (refractive index, extinction coefficient), reflectivity, and others.
+* Ellipsometry
+*Spectrophotometry
+*Microspectrophotometer
+*PhotoLuminescence Mapper
+Mechanical Properties
+Techniques to measure hardness, elasticity, and stress.
+*Stylus profilometer
+*Hardness tester
+*AFM
+Electrical Properties
+*Used to evaluate conductivity, resistivity, and carrier behavior.
+*4-Point Probe, Probe station
+*III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
+*Lifetime scanner MDPmap
+*AFM
+Others
+* Thermal Properties
+* Magnetic Properties
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 == Special Requirements ==