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Specific Process Knowledge/Process Flow: Difference between revisions

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''Drawings in this section done by Jesper Hanberg @DTU Nanolab''
''Drawings in this section done by Jesper Hanberg @DTU Nanolab''
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| align="center" style="color:black" | Clean your Sample [[image:jehanClean.png|130px|frameless|link=Specific Process Knowledge/Wafer cleaning|Wafer cleaning in between process steps may be necessary to ensure the removal of contaminants and particles that could affect subsequent processes (and equipment) and/or final device performance.]]
| width="150" align="center" style="color:black" | Clean your Sample [[image:jehanClean.png|130px|frameless|link=Specific Process Knowledge/Wafer cleaning|Wafer cleaning in between process steps may be necessary to ensure the removal of contaminants and particles that could affect subsequent processes (and equipment) and/or final device performance.]]
| align="center" style="color:black"| Dry your Sample [[image:JehanDry.png|130px|frameless|link=Specific Process Knowledge/Wafer and sample drying|Proper wafer drying ensures that wafer is free from residual water and contaminants after cleaning processes to avoid subsequent processing issues in f.ex. vacuum processes.]]
| width="150" align="center" style="color:black"| Dry your Sample [[image:JehanDry.png|130px|frameless|link=Specific Process Knowledge/Wafer and sample drying|Proper wafer drying ensures that wafer is free from residual water and contaminants after cleaning processes to avoid subsequent processing issues in f.ex. vacuum processes.]]
| align="center" style="color:black"| Deposit a Thin Film [[image:Jehanfilm.png|130px|frameless|link=Specific Process Knowledge/Thin film deposition|Thin film deposition involves creating very thin layers of material on a substrate. F.ex. chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD)]]
| width="150" align="center" style="color:black"| Deposit a Thin Film [[image:Jehanfilm.png|130px|frameless|link=Specific Process Knowledge/Thin film deposition|Thin film deposition involves creating very thin layers of material on a substrate. F.ex. chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD)]]
| align="center" style="color:black"| Dope your Sample [[image:JehanDope.png|130px|frameless|link=Specific Process Knowledge/Doping|Doping is used to modify the electrical properties of semiconductors, typically silicon. By introducing small amounts of impurities (dopants) into the semiconductor, its conductivity can be precisely controlled.]]
| width="150" align="center" style="color:black"| Dope your Sample [[image:JehanDope.png|130px|frameless|link=Specific Process Knowledge/Doping|Doping is used to modify the electrical properties of semiconductors, typically silicon. By introducing small amounts of impurities (dopants) into the semiconductor, its conductivity can be precisely controlled.]]
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| align="center" style="color:black"| Thermal treatment of your Sample [[image:JehanThermal.png|130px|frameless|link=Specific Process Knowledge/Thermal Process|Thermal processes are used to modify material properties through controlled heating, such as thermal oxidation, annealing, diffusion (doping), rapid thermal processing, and pyrolysis.]]
| width="150" align="center" style="color:black"| Thermal treatment of your Sample [[image:JehanThermal.png|130px|frameless|link=Specific Process Knowledge/Thermal Process|Thermal processes are used to modify material properties through controlled heating, such as thermal oxidation, annealing, diffusion (doping), rapid thermal processing, and pyrolysis.]]
| align="center" style="color:black"| Create a Mask on your Sample [[image:Jehanmask.png|130px|frameless|link=Specific Process Knowledge/Pattern Design|Lithography is a common method to create micro- and nanoscale patterns on a substrate. The process commonly involves (a) coating of the substrate with a UV- or DUV-light, or e-beam sensitive resist; (b) exposure of parts of the pattern; and (c) development.]]
| width="150" align="center" style="color:black"| Create a Mask on your Sample [[image:Jehanmask.png|130px|frameless|link=Specific Process Knowledge/Pattern Design|Lithography is a common method to create micro- and nanoscale patterns on a substrate. The process commonly involves (a) coating of the substrate with a UV- or DUV-light, or e-beam sensitive resist; (b) exposure of parts of the pattern; and (c) development.]]
| align="center"  style="color:black"| Transfer a Pattern to your Sample [[image:JehanTransfer.png|130px|frameless|link=Specific Process Knowledge/Etch|Etching is used to remove material from the surface of a substrate to create patterns and structures. Often a mask is used to selectively remove material. Etching can be done by using liquid chemicals (wet etching), or gas or plasma (dry etching ).]]
| width="150" align="center"  style="color:black"| Transfer a Pattern to your Sample [[image:JehanTransfer.png|130px|frameless|link=Specific Process Knowledge/Etch|Etching is used to remove material from the surface of a substrate to create patterns and structures. Often a mask is used to selectively remove material. Etching can be done by using liquid chemicals (wet etching), or gas or plasma (dry etching ).]]
| align="center"  style="color:black"| Create your Structures in Polymer [[image:JehanDefine.png|110px|frameless|link=Specific Process Knowledge/Direct Structure Definition|Structures can be directly created in the device material without an lithography and etch step, though some of the techniques may require a stamp.]]
| width="150" align="center"  style="color:black"| Create your Structures in Polymer [[image:JehanDefine.png|130px|frameless|link=Specific Process Knowledge/Direct Structure Definition|Structures can be directly created in the device material without an lithography and etch step, though some of the techniques may require a stamp.]]
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| align="center" style="color:black"| Bond your Samples together [[image:jehanBond.png|130px|frameless|link=Specific Process Knowledge/Bonding|Some process require to join two or more materials together, to form more complex structures and to create integrated and functional devices. These techniques include eutectic bonding, fusion bonding, anodic bonding, or thermal bonding of two polymer materials.]]
| width="150" align="center" style="color:black"| Bond your Samples together [[image:jehanBond.png|130px|frameless|link=Specific Process Knowledge/Bonding|Some process require to join two or more materials together, to form more complex structures and to create integrated and functional devices. These techniques include eutectic bonding, fusion bonding, anodic bonding, or thermal bonding of two polymer materials.]]
| align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]]
| width="150" align="center" style="color:black"| Characterize your Sample[[image:JehanCharacterize.png|130px|frameless|link=Specific Process Knowledge/Characterization]]
| align="center"  style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]]
| width="150" align="center"  style="color:black"| Cut & Pack your Sample (Backend) <br> <br> [[image:JehanPack.png|130px|frameless|link=Specific Process Knowledge/Back-end processing|Back-end processing, also called Assembly and Packaging, are typical processes used to finish up the wafer/chip fabrication, f.ex. wafer thinning, dicing into chips, bonding to a carrier and connecting it with wires to a printed circuit board (PCB).]]
| align="center"  style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link=Specific Process Knowledge/Solar cell process flow|We have made the process flow for a simple solar cell available. It shows you how to build up a process flow for a component that can be made at DTU Nanolab.]]
| width="150" align="center"  style="color:black"| Process Flow Examples [[image:Processflow b.png|130px|frameless|link=Specific Process Knowledge/Solar cell process flow|We have made the process flow for a simple solar cell available. It shows you how to build up a process flow for a component that can be made at DTU Nanolab.]]
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