Specific Process Knowledge: Difference between revisions
mNo edit summary |
mNo edit summary |
||
| Line 59: | Line 59: | ||
*[[/Characterization|Characterization]] | *[[/Characterization|Characterization]] | ||
*[[/Direct Structure Definition|Direct Structure Definition]] | *[[/Direct Structure Definition|Direct Structure Definition]] (change content or remove sub-point) | ||
*[[/Doping|Doping]] | *[[/Doping|Doping]] | ||
*[[/Etch|Etch]] | *[[/Etch|Etch]] (rename: '''Etching''') | ||
*[[/Imprinting|Imprinting]] | *[[/Imprinting|Imprinting]] (move to "Polymer Processing") | ||
*[[/Lithography|Lithography]] | *[[/Lithography|Lithography]] | ||
*[[/Thermal Process|Thermal Process]] | *[[/Polymer Processing|Polymer Processing]] | ||
*[[/Thermal Process|Thermal Process]] (rename "Thermal Processing") | |||
*[[/Thin film deposition|Thin film deposition]] | *[[/Thin film deposition|Thin film deposition]] | ||
*[[/Wafer and sample drying|Wafer and sample drying]] | *[[/Wafer and sample drying|Wafer and sample drying]] (rename "Wafer/Substrate Cleaning") | ||
*[[/Wafer cleaning|Wafer Cleaning]] | *[[/Wafer cleaning|Wafer Cleaning]] (rename "Wafer/Substrate Drying") | ||
: (maybe combine cleaning and drying?) | |||
Revision as of 06:54, 23 May 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
Feedback to this page: click here
Choose the process topic you are interested in:
General
Characterization (B307/314)
- Layout and Phones/Contacts (New PAGE) (currently under “home” as “Characterization (B314/307) - Layout and Contacts”)
- Getting Started (New PAGE) (NOT DONE YET)
- Safety 314-307 ("Safety" as part of “Getting started”)
Fabrication & Characterization (B346/347)
- Layout and Phones/Contacts (New PAGE) (currently under “home” as “Characterization (B314/307) - Layout and Contacts”)
- include office phone numbers?
- Tool Package Training (rename? Equipment Training Packages)
- The Process Flow (rename, currently "preparation")
- Pattern Design and Mask Fabrication (rename? shorter?)
- Overview of Fume Hoods (rename? Chemical Fume Hoods]
- List of chemicals available in the cleanroom (rename? Cleanroom Chemicals)
Processes and Characterization (Methods) ???
- Direct Structure Definition (change content or remove sub-point)
- Etch (rename: Etching)
- Imprinting (move to "Polymer Processing")
- Thermal Process (rename "Thermal Processing")
- Wafer and sample drying (rename "Wafer/Substrate Cleaning")
- Wafer Cleaning (rename "Wafer/Substrate Drying")
- (maybe combine cleaning and drying?)