Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/IMEC click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/IMEC click here]''' | ||
'''Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Nanolab an '[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and do the cleaning and bonding very early in the morning with few people and thus lower particle level in the cleanroom) gives the best results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Nanolab to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use. | |||
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===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ||