Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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'''The user manual for various HF baths in RCA and Fume hoods, APV's and contact information can be found in LabManager''' [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=64 by clicking here] | '''The user manual for various HF baths in RCA and Fume hoods, APV's and contact information can be found in LabManager''' [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=64 by clicking here] | ||
'''Working with HF above 13% is only allowed by Nanolab staff''' | '''<big>Working with HF above 13% is only allowed by Nanolab staff</big>''' | ||
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*Mainly for removing native oxide | *Mainly for removing native oxide | ||
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*Mainly for etching deep into borofloat or quartz wafers | *Mainly for etching deep into borofloat or quartz wafers. '''Only Nanolab staff are allowed to work with this HF'''. | ||
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*Etching of silicon oxide - especially for etching small holes | *Etching of silicon oxide - especially for etching small holes | ||