Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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!Restrictions | !Restrictions | ||
| | |Low Tg polymer substrates, type IV films, and resist/polymer on substrate | ||
i.e. no resist coated wafers or | i.e. no resist coated wafers or Crystalbonded chips! | ||
|Wafers with metal is not allowed | |Wafers with metal is not allowed | ||
|Resist is not allowed | |Resist is not allowed | ||