Specific Process Knowledge/Lithography: Difference between revisions
Appearance
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'''<big><div class="center">Pre-lithography</div></big>''' | '''<big><div class="center">Pre-lithography</div></big>''' | ||
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'''[[Specific Process Knowledge/Lithography/Resist|Resist]]''' | '''[[Specific Process Knowledge/Lithography/Resist|Resist]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]] | *[[Specific_Process_Knowledge/Lithography/Resist#User_resist_bottles_in_the_cleanroom|User bottles in the cleanroom]] | ||
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*[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]] | *[[Specific_Process_Knowledge/Lithography/Resist#E-beam_Resist|E-beam Resist]] | ||
*[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]] | *[[Specific_Process_Knowledge/Lithography/Resist#Imprint_Resist|Imprint Resist]] | ||
'''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]''' | '''[[Specific Process Knowledge/Lithography/Pretreatment|Substrate Pre-treatment]]''' | ||
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'''<big><div class="center">Coating</div></big>''' | '''<big><div class="center">Coating</div></big>''' | ||
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'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]] | ||
*[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]] | *[[Specific Process Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper|Spin Coater: Süss Stepper]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV|Spin Coater: Gamma e-beam & UV]] | ||
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]''' | ||
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | *[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: Labspin 02/03]] | ||
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]] | *[[Specific_Process_Knowledge/Lithography/Coaters#Spray_Coater|Spray Coater]] | ||
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]''' | '''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]''' | ||
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'''<big><div class="center">Exposure/design transfer</div></big>''' | '''<big><div class="center">Exposure/design transfer</div></big>''' | ||
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'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]''' | '''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]''' | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]] | *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-1|Aligner: MA6-1]] | ||
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*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]] | *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03|Aligner: Maskless 03]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]] | *[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_04|Aligner: Maskless 04]] | ||
'''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]''' | '''[[Specific_Process_Knowledge/Lithography/DUVStepperLithography|Deep-UV Exposure]]''' | ||
*[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]] | *[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#DUV_Stepper|DUV Stepper (Canon FPA-3000EX4)]] | ||
'''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]''' | '''[[Specific Process Knowledge/Lithography/EBeamLithography|Electron Beam Exposure]]''' | ||
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]] | *[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_9500_User_Guide|JEOL 9500]] | ||
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]] | *[[Specific_Process_Knowledge/Lithography/EBeamLithography/eLINE|Raith Eline]] | ||
'''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]''' | '''[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]''' | ||
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'''<big><div class="center">Development</div></big>''' | '''<big><div class="center">Development</div></big>''' | ||
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'''[[Specific Process Knowledge/Lithography/Development|Manual development]]''' | '''[[Specific Process Knowledge/Lithography/Development|Manual development]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]] | *[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]] | ||
'''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]''' | '''[[Specific Process Knowledge/Lithography/Development|SU-8 development]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8_(Wet_Bench)|Developer: SU8 (Wetbench)]] | *[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8_(Wet_Bench)|Developer: SU8 (Wetbench)]] | ||
'''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]''' | '''[[Specific Process Knowledge/Lithography/Development|Semi-automatic puddle development]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam_02|Developer: E-beam 02]] | *[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam_02|Developer: E-beam 02]] | ||
*[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual_02|Developer: TMAH Manual 02]] | *[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual_02|Developer: TMAH Manual 02]] | ||
'''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]''' | '''[[Specific Process Knowledge/Lithography/Development|Automatic puddle development]]''' | ||
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'''<big><div class="center">Post-lithography</div></big>''' | '''<big><div class="center">Post-lithography</div></big>''' | ||
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'''[[Specific Process Knowledge/Lithography/Descum|Descum]]''' | '''[[Specific Process Knowledge/Lithography/Descum|Descum]]''' | ||
*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]] | *[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Plasma Asher 3: Descum]] | ||
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*[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_5|Plasma Asher 5]] | *[[Specific Process Knowledge/Lithography/Descum#Plasma_Asher_5|Plasma Asher 5]] | ||
*[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]] | *[[Specific_Process_Knowledge/Etch/Wet_Silicon_Oxide_Etch_(BHF)|BHF]] | ||
'''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]''' | '''[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]''' | ||
*[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]] | *[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]] | ||
'''[[Specific Process Knowledge/Lithography/Strip|Strip]]''' | '''[[Specific Process Knowledge/Lithography/Strip|Strip]]''' | ||