Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured) | PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured) | ||
Normally the etch is reused, but if you need to dispose it, collect it in a bottle marked O waste. | Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked O waste. | ||
===Overview of the chromium etch process=== | ===Overview of the chromium etch process=== | ||