Specific Process Knowledge/Etch/Lithium niobate

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Etching of Titanium

Etching of titanium can be done either by wet etch, dry etch or by sputtering with ions.

• Etching of Ti by wet etch
• Etching of Ti by dry etch
• Sputtering of Ti

Comparison of Titanium Etch Methodes

		IBE (Ionfab300+)	ASE
Generel description		Sputtering of Lithium niobate - pure physical etch This is the dryetcher we prefer you use for Lithium niobate etching as lithium does not form any volatile etch products. You can assist it with CHF3 if you want that.	This is an ICP and is for etching materials that forms volatile etch products with fluorine chemistry. We have allowed some lithium niobate etching to be done in this machine but we are not super happy with that since there will be redeposition inside the chamber. Please talk to us about it if you can to do it.
Etch rate range		~20nm/min	Depending on features size and etch load and recipe settings. We have not recipe for this - you are on your own.
Etch profile		Anisotropic (angles sidewalls, typical around 70 dg)	Anisotropic - expect angles sidewalls.
Substrate size		Smaller pieces glued to carrier wafer #1 50mm wafer #1 100mm wafer #1 150mm wafer #1 200mm wafer	smaller pieces on a carrier wafer #1 100 mm wafer
Allowed materials		Silicon Silicon oxides Silicon nitrides Lithium niobate Metals from the +list Metals from the -list Alloys from the above list Stainless steel Glass III-V materials Resists Polymers Capton tape And many more, please ask the Dryetch group	Silicon Quartz/fused silica Photoresist/e-beam resist PolySilicon, Silicon oxide Silicon (oxy)nitride Less than 4 cm2 of many other materials, check out the cross contamination sheet in LabManager