Jump to content

Specific Process Knowledge/Etch/Lithium niobate: Difference between revisions

← Older editNewer edit →
VisualWikitext
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,301 edits
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,301 edits
Line 25: Line 25:
!
!
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]]
!
!
!
|-
|-
Line 33: Line 33:
!Generel description
!Generel description
|
|
|Sputtering of Ti - pure physical etch
|Sputtering of Lithium niobate - pure physical etch
|Dry plasma etch of Ti
|Dry plasma etch of Ti
|
|
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Lithium_niobate"