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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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'''2.2µm AZ 5214E:''' (image reversal)
'''2.2µm AZ 5214E:''' (image reversal)
*Reversal bake: 60s-120s @ 110°C
*Reversal bake: 60s-120s @ 110°C
*Flood exposure: ~200-500 mJ/cm<sup>2</sup>
*Flood exposure: ~500 mJ/cm<sup>2</sup>
*Development: SP 60s
*Development: SP 60s


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