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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing: Difference between revisions

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[[Image:section under construction.jpg|70px]]
[[Image:section under construction.jpg|70px]]


During load, the machine will focus on the surface of the sample. Then, using the automatic focusing system, it will detect the edges of the sample (this function depends on the substrate template used) in order to determine the center of the sample. The following results rapport findings using the "4 inch wafer" template on a standard 100mm Si substrate.
During load, the machine will focus on the surface of the sample. Then, using the automatic focusing system, it will detect the edges of the sample (this function depends on the substrate template used) in order to determine the center of the sample. The following results rapport findings using the "Wafer (d=100 mm; Flat)" template on a standard 100mm Si substrate.


==Substrate centering==
==Substrate centering==