Specific Process Knowledge/Lithography/Descum: Difference between revisions
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=Plasma Asher 4= | =Plasma Asher 4= | ||
Descum of AZ 5214E on 100 mm wafers. The descum process development was done for a single substrate, as well as 3 substrates (for decreased ashing rate and improved ashing uniformity). The substrates were placed vertically in the glass boat. | Descum of AZ 5214E on 100 mm wafers. The descum process development was done for a single substrate, as well as 3 substrates (for decreased ashing rate and improved ashing uniformity). The substrates were placed vertically in the glass boat. | ||
<gallery style="text-align: center;" widths=250 heights=250> | |||
PA_boat_1Wafer_v2.png|Single vertical substrate | |||
PA_boat_3Wafer_v2.png|3 vertical substrates | |||
</gallery> | |||
For the 3 substrates only the center substrate was used for testing, the front and back wafers were used as dummy wafers. The wafers were placed in consecutive slots - when running multiple wafers in this way, the first and last wafers should always be dummy wafers. | For the 3 substrates only the center substrate was used for testing, the front and back wafers were used as dummy wafers. The wafers were placed in consecutive slots - when running multiple wafers in this way, the first and last wafers should always be dummy wafers. | ||