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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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==Overview of wet bench 06 and 07==
==Overview of wet bench 06 and 07==
 
{| class="wikitable"
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
|-
 
!  !! [[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]] !! [[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
|-style="background:silver; color:black"
|-
|
! scope=row| Process
! [[Specific Process Knowledge/Lithography/Strip#Resist_Strip|Resist Strip]]  
| Wet resist strip || Metal lift-off process
! [[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]
|-  
 
|-style="background:whitesmoke; color:black"
!General description'''
|Wet stripping of resist
|Lift-off process
|-
|-
 
! scope=row| Chemical
|-style="background:silver; color:black"
| Remover 1165 (NMP) || Remover 1165 (NMP)
!Chemical solution
|NMP Remover 1165
|NMP Remover 1165
|-
|-
 
! scope=row| Process temperature
|-style="background:whitesmoke; color:black"
| Up to 65°C || Up to 65°C
!Process temperature
|Up to 65°C
|Up to 65°C
|-
|-
 
! scope=row| Substrate batch
|-style="background:silver; color:black"
| 1-25 wafers || 1-25 wafers
!Batch size
|
1 - 25 wafers
|
1 - 25 wafers
|-
|-
 
! scope=row| Substrate size
|-style="background:whitesmoke; color:black"
|  
!Size of substrate
|
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
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*150 mm wafers
*150 mm wafers
|-
|-
 
! scope=row| Materials allowed
|-style="background:silver; color:black"
|  
!Allowed materials
|
*Silicon
*Silicon
*Silicon Oxide
*Silicon oxide
*Silicon Nitride
*Silicon nitride
*Silicon Oxynitride
*Silicon oxynitride
|
| All metals except Type IV (Pb, Te)
All metals except Type IV (Pb, Te)
|-
|}
|}


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