Specific Process Knowledge/Lithography/Descum: Difference between revisions
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[[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]] | [[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]] | ||
{| class="wikitable" style="caption-side: top; text-align: | {| class="wikitable" style="text-align: center;" | ||
|+ style="caption-side: top; text-align: left;" | Ashing amount and rate | |||
|- | |- | ||
! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ||
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|} | |} | ||
{| class="wikitable" style="caption-side: top; text-align: | {| class="wikitable" style="text-align: center;" | ||
|+ style="caption-side: top; text-align: left;" | Ashing non-uniformity | |||
|- | |- | ||
! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ||