Specific Process Knowledge/Lithography/Descum: Difference between revisions
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==Single wafer ashing rate an uniformity== | ==Single wafer ashing rate an uniformity== | ||
[[File:PA_descum_single_v3.png|400px|thumb|Ashing amount and ashing rate when processing a single 100 mm wafer.|right]] | [[File:PA_descum_single_v3.png|400px|thumb|Ashing amount and ashing rate when processing a single 100 mm wafer.|right]] | ||
{| class="wikitable" | {| class="wikitable" | ||
|+ Ashing amount and rate | |||
|- | |- | ||
! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ||
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|} | |} | ||
{| class="wikitable" | {| class="wikitable" | ||
|+ Ashing non-uniformity | |||
|- | |- | ||
! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15 | ||