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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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==Comparison of ashing rate between substrate sizes for plasma asher 4 & 5==
==Comparison of ashing rate between substrate sizes for plasma asher 4 & 5==
[[File:PA_comparison_v2.png|400px|thumb|Comparison of ashing rate with different sibstrate sizes. Process was done using a single substrate placed in the middle of the glass boat, which was placed in the center of the chamber.|right]]
[[File:PA_comparison_v3.png|400px|thumb|Comparison of ashing rate with different substrate sizes. Process was done using a single substrate placed in the middle of the glass boat, which was placed in the center of the chamber.|right]]
The ashing rate is slightly higher for 100 mm substrates, but there is no difference between a 150 mm wafer and a 200 mm wafer.  
The ashing rate is highest for 100 mm substrates, lower for 150 mm substrates and even lower for 200 mm substrates.  


All substrate sizes seems to follow the same pattern; ashing rate increases with a higher percentage nitrogen in the gas mix and also with a higher chamber pressure. The total gas flow has only little influence on the ashing rate, but slightly favors the lower flow rate of 200 sccm, similar to previous experiment results.
All substrate sizes follows the same pattern:
*Ashing rate increases with a higher percentage nitrogen in the gas mix
*Ashing rate increases with a higher chamber pressure
*The total gas flow has only little influence on the ashing rate, but <i>slightly</i> favors the lower flow rate of 200 sccm, similar to previous experiment results


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'''Process parameter impact on ashing rate'''<br>
'''Process parameter impact on ashing rate'''<br>
Looking at ashing rate, using linear regression models on the process parameters, indicates that the gas mix and the chamber pressure has a significant impact on the ashing rate, while the gas flow has only little effect:
Investigating the ashing rate using linear regression models on the process parameters, indicates that the gas mix and the chamber pressure has a significant impact on the ashing rate, while the gas flow has only little effect:
<gallery mode="packed-hover" heights="150">
<gallery mode="packed-hover" heights="150">
ParamEffect_100_mm_v1.png|100 mm process parameter impact
ParamEffect_100_mm_v1.png|100 mm process parameter impact