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= Strip Comparison Table =
= Strip Comparison Table =
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
{| class="wikitable"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 3: Descum|Plasma Asher 3: Descum]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 5|Plasma Asher 5]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Resist Strip|Resist strip]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</b>
 
|-
|-
!style="background:silver; color:black;" align="center"|Purpose
!
|style="background:LightGrey; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 3: Descum|Plasma Asher 3: Descum]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4 (Clean)]]
Resist descum
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 5|Plasma Asher 5 (Dirty)]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Resist Strip|Resist strip]]
'''Clean wafers only:'''<br>
! [[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]
No metal<br>
No metal oxides<br>
No III-V materials
|style="background:WhiteSmoke; color:black"|
All purposes
|style="background:WhiteSmoke; color:black"|
Resist strip - no metal lift off!
|style="background:WhiteSmoke; color:black"|
Lift-off
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
! scope=row| Purpose
|style="background:LightGrey; color:black"|
| Resist descum
|style="background:WhiteSmoke; color:black"|
|
Plasma ashing
*Resist stripping
|style="background:WhiteSmoke; color:black"|
*Resist descum
Plasma ashing
|
|style="background:WhiteSmoke; color:black"|
*Resist stripping
Plasma ashing
*Resist descum
|style="background:WhiteSmoke; color:black"|
| Resist stripping
Solvent and ultra sound
| Metal lift-off
|style="background:WhiteSmoke; color:black"|
Solvent and ultra sound
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row| Method
|style="background:LightGrey; color:black"|Process gasses
| Plasma ashing
|style="background:WhiteSmoke; color:black"|
| Plasma ashing
*O<sub>2</sub> (flow unknown)
| Plasma ashing
|style="background:WhiteSmoke; color:black"|
| Solvent & ultrasonication
| Solvent & ultrasonication
|-
! scope=row| Process: Gasses
| O<sub>2</sub> (50 sccm)
|
*O<sub>2</sub> (0-500 sccm)
*O<sub>2</sub> (0-500 sccm)
*N<sub>2</sub> (0-500 sccm)
*<sub>2</sub> (0-500 sccm)
|style="background:WhiteSmoke; color:black"|
|
*O<sub>2</sub> (0-500 sccm)
*O<sub>2</sub> (0-500 sccm)
*N<sub>2</sub> (0-500 sccm)
*N<sub>2</sub> (0-500 sccm)
*CF<sub>4</sub> (0-200 sccm)
*CF<sub>4</sub> (0-200 sccm)
|style="background:WhiteSmoke; color:black"|
| NA
*NA
| NA
|style="background:WhiteSmoke; color:black"|
*NA
 
|-
|-
|style="background:LightGrey; color:black"|Max. process power
! scope=row| Process: Power
|style="background:WhiteSmoke; color:black"|
| 10-100 W (10-100%)
100 W (100%)
| 150-1000 W
|style="background:WhiteSmoke; color:black"|
| 150-1000 W
1000 W
| NA
|style="background:WhiteSmoke; color:black"|
| NA
1000 W
|style="background:WhiteSmoke; color:black"|
*NA
|style="background:WhiteSmoke; color:black"|
*NA
 
|-
|-
|style="background:LightGrey; color:black"|Solvent
! scope=row| Process: Solvent
|style="background:WhiteSmoke; color:black"|
| NA
*NA
| NA
|style="background:WhiteSmoke; color:black"|
| NA
*NA
|
|style="background:WhiteSmoke; color:black"|
*NA
|style="background:WhiteSmoke; color:black"|
*NMP (Remover 1165)
*NMP (Remover 1165)
*Rinse in IPA
*IPA (rinsing agent)
|style="background:WhiteSmoke; color:black"|
|
*NMP (Remover 1165)
*NMP (Remover 1165)
*Rinse in IPA
*IPA (rinsing agent)
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row| Substrate: Batch
|style="background:LightGrey; color:black"|Batch size
|
|style="background:WhiteSmoke; color:black"|
*Chips: several
*1 small sample
*50 mm wafer: several
*1 50 mm wafer
*100 mm wafer: 1
*1 100 mm wafer
|
|style="background:WhiteSmoke; color:black"|
*Chips: several
*1 small sample
*50 mm wafer: several
*1 50 mm wafer
*100 mm wafer: 1-25
*1-25 100 mm wafers
*150 mm wafer: 1-25
*1-25 150 mm wafers
*200 mm wafer: 1-25
*1-25 200 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*Chips: several
*1 small sample
*50 mm wafer: several
*1 50 mm wafer
*100 mm wafer: 1-25
*1-25 100 mm wafers
*150 mm wafer: 1-25
*1-25 150 mm wafers
*200 mm wafer: 1-25
*1-25 200 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*100 mm wafer: 1-25
*1 - 25 100 mm wafers
*150 mm wafer: 1-25
*1 - 25 150 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*100 mm wafer: 1-25
*1 - 25 100 mm wafers
*150 mm wafer: 1-25
*1 - 25 150 mm wafers
|-
|-
|style="background:LightGrey; color:black"|Allowed materials
! scope=row| Substrate: Materials
|style="background:WhiteSmoke; color:black"|
|
*Silicon, glass, and polymer substrates
*Silicon substrates
*Film or pattern of all but Type IV
*Glass substrates
|style="background:WhiteSmoke; color:black"|
*Polymer substrates
*<b>No metals</b><br>
*Films, or patterned films, of any material except type IV (Pb, Te)
*<b>No metal oxides</b><br>
|
*<b>No III-V materials</b>
<span style="color:red">'''No metals'''</span><br>
*Silicon, glass, and polymer substrates
<span style="color:red">'''No metal oxides'''</span><br>
*Film or pattern of photoresist/polymer
<span style="color:red">'''No III-V materials'''</span><br>
|style="background:WhiteSmoke; color:black"|
*Silicon substrates
*Silicon, III-V, and glass substrates
*Glass substrates
*Film or pattern of all but Type IV
*Polymer substrates
|style="background:WhiteSmoke; color:black"|
*Films, or patterned films, of resists/polymers
*<b>No metals</b><br>
|
*<b>No metal oxides</b><br>
*Silicon substrates
*Silicon, glass, and polymer substrates
*III-V substrates
*Film or pattern of photoresist/polymer
*Glass substrates
|style="background:WhiteSmoke; color:black"|
*Polymer substrates
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
*Film or pattern of all but Type IV
|
|-
<span style="color:red">'''No metals'''</span><br>
<span style="color:red">'''No metal oxides'''</span><br>
*Silicon substrates
*Glass substrates
*Polymer substrates
*Films, or patterned films, of resists/polymers
|
*Silicon substrates
*Glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|}
|}


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