Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions
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=Using the standard Cr etch recipe I was etching through 100 nm Cr on a 150 mm wafer it an etch load of 50%= | =Using the standard Cr etch recipe I was etching through 100 nm Cr on a 150 mm wafer it an etch load of 50%= | ||
I recorded the end point signal and tried three different stopping times to figure out when to stop the etch. I want to find out how I can use the end point signal to get the best etch result; Etch | I recorded the end point signal and tried three different stopping times to figure out when to stop the etch. I want to find out how I can use the end point signal to get the best etch result; Etch through - also in the small patterns without too much over etch. | ||
I was looking at trenches with sizes ranging from 200 nm to 2 µm in width. The masking materials was negative DUV resist: NUV 2300-0.5 of approximately 500 nm. Here process flow can be seen here: [[:File:Process_flow_for_test_wafers xx.pdf]] | I was looking at trenches with sizes ranging from 200 nm to 2 µm in width. The masking materials was negative DUV resist: NUV 2300-0.5 of approximately 500 nm. Here process flow can be seen here: [[:File:Process_flow_for_test_wafers xx.pdf]] | ||