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Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,304 edits
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<gallery caption="S047670 30 s barc etch, 7:45 min Cr etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">
<gallery caption="S047670 1 min barc etch, 7:45 min Cr etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">


File:S047670midt_cr_05.jpg
File:S047670midt_cr_05.jpg
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<gallery caption="S047670 30 s barc etch, 7:45 min Cr etch, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">
<gallery caption="S047670 1 min barc etch, 7:45 min Cr etch, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1">


File:S047670edge_cr_01.jpg
File:S047670edge_cr_01.jpg
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