Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions
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<gallery caption="S047676 X min, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths=" | <gallery caption="S047676 X min, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1"> | ||
File:S047676midt_cr_01.jpg | File:S047676midt_cr_01.jpg | ||
File:S047676midt_cr_02.jpg | File:S047676midt_cr_02.jpg | ||
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<gallery caption="S047676 X min, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths=" | <gallery caption="S047676 X min, Feb-2025, wafer edge, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="1"> | ||
File:S047676edge_cr_01.jpg | File:S047676edge_cr_01.jpg | ||
File:S047676edge_cr_04.jpg | File:S047676edge_cr_04.jpg | ||