Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions
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Upgrading til silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards the end of 2010. | Upgrading til silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards the end of 2010. | ||
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of Photo Resist using RIE]] | |||
Revision as of 13:23, 5 May 2011
Upgrading til silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards the end of 2010.