Specific Process Knowledge/Back-end processing: Difference between revisions

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These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
 
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! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
! '''Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.'''
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| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.  
| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.  

Revision as of 17:23, 13 February 2025

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab is currently under re-construction and planned to re-open in Q2 2025.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Choose processing method

Lapping/polishing Cutting/cleaving Milling Die bonding Wire bonding
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