Specific Process Knowledge/Lithography/Strip: Difference between revisions
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!style="background:silver | !style="background:silver; color:black;" align="center"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Resist descum | Resist descum | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Clean wafers only | '''Clean wafers only:'''<br> | ||
No metal<br> | |||
No metal oxides<br> | |||
No III-V materials | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
All purposes | All purposes | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Resist strip | Resist strip - no metal lift off! | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Lift-off | Lift-off | ||