Specific Process Knowledge/Lithography/Strip: Difference between revisions
| Line 261: | Line 261: | ||
Total gas flow rate: 500 sccm<br> | Total gas flow rate: 500 sccm<br> | ||
Gas mix ratio: 30% | Gas mix ratio: 30% nitrogen<br> | ||
Chamber pressure: tested parameter<br> | Chamber pressure: tested parameter<br> | ||
Power: 1000 W<br> | Power: 1000 W<br> | ||
| Line 272: | Line 272: | ||
Total gas flow rate: 200 sccm<br> | Total gas flow rate: 200 sccm<br> | ||
Gas mix ratio: 30% | Gas mix ratio: 30% nitrogen<br> | ||
Chamber pressure: tested parameter<br> | Chamber pressure: tested parameter<br> | ||
Power: 1000 W<br> | Power: 1000 W<br> | ||