Specific Process Knowledge/Lithography/Strip: Difference between revisions
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[[File:PA_flowRateFullBoat_v1.png|320px|thumb|Ashing rate as function of total gas flow when processing a full boat of 25 100 mm wafers.|right]] | [[File:PA_flowRateFullBoat_v1.png|320px|thumb|Ashing rate as function of total gas flow when processing a full boat of 25 100 mm wafers.|right]] | ||
Test using a boat of 25 100 mm wafers in the center of the process chamber shows that | Test using a boat of 25 100 mm wafers in the center of the process chamber shows that a total flow rate of 200 sccm gives the highest ashing rate. | ||
<b>Test parameters:</b><br> | <b>Test parameters:</b><br> | ||