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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,917 edits
Line 121: Line 121:
*Film or pattern of all but Type IV
*Film or pattern of all but Type IV
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<b>No metals allowed! This includes metal oxides</b>
*<b>No metals allowed - including metal oxides</b><br>
*<b>No III-V materials</b>
*Silicon, glass, and polymer substrates
*Silicon, glass, and polymer substrates
*Film or pattern of photoresist/polymer
*Film or pattern of photoresist/polymer
Line 128: Line 129:
*Film or pattern of all but Type IV
*Film or pattern of all but Type IV
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<b>No metal allowed!</b>
*<b>No metals allowed - including metal oxides</b><br>
*Silicon, glass, and polymer substrates
*Silicon, glass, and polymer substrates
*Film or pattern of photoresist/polymer
*Film or pattern of photoresist/polymer
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