Specific Process Knowledge/Etch/DRIE-Pegasus/DREM: Difference between revisions
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| Line 21: | Line 21: | ||
|PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | |PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | ||
|C4F8DepDelay=0.3@5 |C4F8DepBoost= 0.5@50 |C4F8DepMain=200 | |C4F8DepDelay=0.3@5 |C4F8DepBoost= 0.5@50 |C4F8DepMain=200 | ||
|C4F8EtchDelay=0.5@100 |C4F8EtchBoost= |C4F8EtchMain=5 | |C4F8EtchDelay=0.5@ 100 |C4F8EtchBoost= |C4F8EtchMain=5 | ||
|SF6DepDelay=0.3@200 |SF6DepBoost=0.5@200 |SF6DepMain=15 | |SF6DepDelay=0.3@ 200 |SF6DepBoost=0.5@ 200 |SF6DepMain=15 | ||
|SF6EtchDelay=2@15 |SF6EtchBoost=0.3@100 |SF6EtchMain=200 | |SF6EtchDelay=2@ 15 |SF6EtchBoost=0.3@ 100 |SF6EtchMain=200 | ||
|O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | |O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | ||
|WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | |WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | ||
|WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@100 |WPlatenEtchMain=1 | |WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@ 100 |WPlatenEtchMain=1 | ||
|WClaritasDep= |WClaritasEtch= | |WClaritasDep= |WClaritasEtch= | ||
|%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | |%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | ||
| Line 43: | Line 43: | ||
|PressureDepDelay= |PressureDepBoost= |PressureDepMain=100% | |PressureDepDelay= |PressureDepBoost= |PressureDepMain=100% | ||
|PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | |PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | ||
|C4F8DepDelay=0.3@5 |C4F8DepBoost= 0.5@50 |C4F8DepMain=200 | |C4F8DepDelay=0.3 @5 |C4F8DepBoost= 0.5@ 50 |C4F8DepMain=200 | ||
|C4F8EtchDelay=0.5@100 |C4F8EtchBoost= |C4F8EtchMain=5 | |C4F8EtchDelay=0.5@ 100 |C4F8EtchBoost= |C4F8EtchMain=5 | ||
|SF6DepDelay=0.3@200 |SF6DepBoost=0.5@200 |SF6DepMain=15 | |SF6DepDelay=0.3@ 200 |SF6DepBoost=0.5@ 200 |SF6DepMain=15 | ||
|SF6EtchDelay=2@15 |SF6EtchBoost=0.3@100 |SF6EtchMain=200 | |SF6EtchDelay=2@ 15 |SF6EtchBoost=0.3@ 100 |SF6EtchMain=200 | ||
|O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | |O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | ||
|WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | |WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | ||
|WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@100 |WPlatenEtchMain=1 | |WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@ 100 |WPlatenEtchMain=1 | ||
|WClaritasDep= |WClaritasEtch= | |WClaritasDep= |WClaritasEtch= | ||
|%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | |%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | ||
Revision as of 09:19, 20 November 2024
The DREM processes
DREM 2kW micro
| Recipe | General | Pressure | Gases | Generators | Matching | Results | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| C4F8 | SF6 | Coil | Platen | Coil | Platen | |||||||||||||||||
| T | S/E | Dp | D | B | M | D | B | M | D | B | M | Dp | Dep | L | T | L | T | Pressure | Runs | |||
| H/L | Cyc | Et | D | B | M | D | B | M | D | B | M | Et | D | B | M | L | T | L | T | Keywords | ||
| DREM 2kW micro | Pump to base, Clamp Substrate, home platen matching unit, stabilisation | 8 | ||||||||||||||||||||
| 0 | D/E | 1.2 | 100% | 0.3@5 | 0.5@50 | 200 | 0.3@ 200 | 0.5@ 200 | 15 | 2 | 1 | 40 | 50 | 32.5 | 51.9 | |||||||
| HF | 3 | 100% | 0.5@ 100 | 5 | 2@ 15 | 0.3@ 100 | 200 | 2 | 1@1 | 1@ 100 | 1 | 40 | 50 | 32.5 | 51.9 | |||||||
| DREM 2kW micro | Pump to base, Clamp Substrate, home platen matching unit, stabilisation | 1 | ||||||||||||||||||||
| -19 | D/E | 1.2 | 100% | 0.3 @5 | 0.5@ 50 | 200 | 0.3@ 200 | 0.5@ 200 | 15 | 2 | 1 | 40 | 50 | 32.5 | 51.9 | |||||||
| HF | 3 | 100% | 0.5@ 100 | 5 | 2@ 15 | 0.3@ 100 | 200 | 2 | 1@1 | 1@ 100 | 1 | 40 | 50 | 32.5 | 51.9 | |||||||