Specific Process Knowledge/Wafer and sample drying/Spin Dryers: Difference between revisions

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 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b>
 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b>
-|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 5</b>
+|style="background:WhiteSmoke; color:black"|<b>Spin dryer 6</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Location
 |style="background:LightGrey; color:black"|
-|style="background:WhiteSmoke; color:black"|
-*E-4
 |style="background:WhiteSmoke; color:black"|
 *B-1
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 !style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|
-|style="background:WhiteSmoke; color:black"|
-*Drying
-*Rinsing + drying
 |style="background:WhiteSmoke; color:black"|
 *Drying
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 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
-|style="background:WhiteSmoke; color:black"|
-*1-25 100 mm wafers
 |style="background:WhiteSmoke; color:black"|
 *1-25 100 mm wafers
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 |-
 | style="background:LightGrey; color:black"|Allowed materials
-|style="background:WhiteSmoke; color:black"|
-*No restrictions
 |style="background:WhiteSmoke; color:black"|
 *Only for RCA cleaned wafers