Specific Process Knowledge/Wafer and sample drying: Difference between revisions
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|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 5|Spin dryer 5]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 5|Spin dryer 5]] | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]] | ||
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]] | |[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]] | ||
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*D-3 | *D-3 | ||
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*In fumehoods and at chemical benches | *In fumehoods and at chemical benches | ||
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*Drying | *Drying | ||
*Rinsing + drying | *Rinsing + drying | ||
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*Drying sensitive samples. E.g. with cantilevers | *Drying sensitive samples. E.g. with cantilevers | ||
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*1 to 5 wafers per run. Sizes: 2”, 4" or 6" | *1 to 5 wafers per run. Sizes: 2”, 4" or 6" | ||
* Pieces (up to 10x10mm) | * Pieces (up to 10x10mm) | ||
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*One sample at a time | *One sample at a time | ||
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*InAlP, GaAs | *InAlP, GaAs | ||
*SU8 | *SU8 | ||
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*No restriction | *No restriction | ||