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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,317 edits
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File:C010184tilt20plasmaO2_07.jpg| tilt 20 degrees
File:C010184tilt20plasmaO2_07.jpg| tilt 20 degrees
File:C010184tilt20plasmaO2_05.jpg| tilt 20 degrees
File:C010184tilt20plasmaO2_05.jpg| tilt 20 degrees
</gallery>[[File:C1018405.jpg|thumb|After RCA clean]]
File:C1018405.jpg|After RCA clean
File:C1018402.jpg|After RCA clean
File:C1018403.jpg|After RCA clean
</gallery>
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