Specific Process Knowledge/Wafer and sample drying: Difference between revisions
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#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM | #Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM | ||
All spin dryers use the following carriers: | |||
*100 mm wafers: A72-40MB | |||
*150 mm wafers: A182-60MB | |||
*200 mm wafers: A192-80M | |||
< | <span style="color:red">It is not allowed to use other carriers in the spin dryers, as this may damage the motor due to incorrect mass distribution. It may also cause fragile wafers to break due to excessive vibrations caused by the mass imbalance.</span> | ||
== Spin dryer 2 == | |||
[[File:Spin_dryer_2ny.jpg|640px|thumb|right]] | |||
Spin dryer 2 is for RCA processing only, and is located in B-1 next to the RCA bench. | |||
*Top chamber: 100 mm wafers | |||
*Bottom chamber: 150 mm wafers | |||
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== Spin dryer 3 == | |||
[[File:Spin_dryer_3.jpg|640px|thumb|right]] | |||
Spin dryer 3 is located in D-3 between the working table and wet bench 03. | |||
*Top chamber: 100 mm wafers | |||
*Bottom chamber: 150 mm wafers | |||
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== Spin dryer 4 == | |||
[[File:Spin_dryer_3.jpg|640px|thumb|right]] | |||
Spin dryer 4 is located in D-3 between the HF vapor phase etcher and wet bench 07. | |||
*Top chamber: 100 mm wafers | |||
*Bottom chamber: 150 mm wafers | |||
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== Spin dryer 5 == | |||
[[File:Spin_dryer_5.JPG|640px|thumb|right]] | |||
Spin dryer 5 is located in F-3 Next to the Developer: TMAH stepper. It has a single process chamber that is capable of processing 100 mm, 150 mm and 200 mm wafers. The wafer size is easily changed, by changing the rotor insert frame. | |||
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