Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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 == Process information ==
-Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.
+Standard process is:
+#Rinse (with DI water) for 60 seconds at 500 RPM
+#Dry with nitrogen for 150 seconds at 1800 RPM
+#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM
-''If'' rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.
 <gallery caption="Different places to dry your wafers" widths="275px" heights="225px" perrow="5">