Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | *[[/Leybold|Leybold]] - ''E-beam evaporator and multiple wafer tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | |||
*[[/Hummer|Hummer]] - ''Gold sputtering system'' | *[[/Hummer|Hummer]] - ''Gold sputtering system'' | ||
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition'' | ||