Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions

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 #Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other.
 #Deposite the thin film
-#Measure the wafer bow again on the same profilometer as used for the pre-measurement with the same recipe and on the same position/positions on the wafer as the pre-measurement .
+#Measure the wafer bow again:
+##On the same profilometer as used for the pre-measurement.
+##With the same recipe as used for the pre-mesurement.
+##On the same position/positions on the wafer as the pre-measurement .
 #Measure the thickness  of the substrate
 #Measure the thickness of the thin film (ex. using the FilmTek or the Ellipsometer is possible).
 #Use the program for stress measurement in the profilometer software on the profilometer you used for the measurements. Use both the pre-stress measurement and the post-stress measurement.