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== Dosetests ==
So far (September 2014) three wafers with CSAR have been e-beam exposed with dosetests and inspected in SEM. Thickness of resist, e-beam dose and development time has been changed somewhat from wafer to wafer:
style = "border-radius: 6px; border: 3px solid #000000;
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 90%; style = "border-radius: 6px; border: 2px solid #000000;"
|-
|-
|-style="background:Black; text-align:left; color:White"
!rowspan="2"|Process
!rowspan="2"|Equipment
!colspan="3"|Parameters
|-
|-
|-style="background:Black; text-align:left; color:White"
!width="300"|6.13
!width="300"|4.09
!width="300"|3.05
|-
|-
|-style="background:WhiteSmoke; color:black"
|Resist
|Fumehood D-3
|'''Resist:''' AR-P 6200/2 diluted 1:1 in anisole (Bottled opened 16-06-2014 TIGRE)
|'''Resist:''' AR-P 6200/2 diluted 1:1 in anisole (Bottled opened 16-06-2014 TIGRE)
|'''Resist:''' AR-P 6200/2
|-
|-style="background:WhiteSmoke; color:black"
|Spin Coat
|Spin Coater LabSpin A-5
|'''Spin:''' 1 min @ 6000 rpm,<br /> '''softbake:''' 1 min @ 150 degC, <br />'''thickness:''' ~50nm <br />(27-08-2014 TIGRE)
|'''Spin:''' 1 min @ 5000 rpm,<br /> '''softbake:''' 2 min @ 150 degC, <br />'''thickness:''' ~53nm <br />(16-06-2014 TIGRE)
|'''Spin:''' 1 min @ 6000 rpm,<br /> '''softbake:''' 5 min @ 150 degC, <br />'''thickness:''' ~143nm <br />(09-04-2014 TIGRE)
|-
|-
|-style="background:WhiteSmoke; color:black"
|E-beam exposure
|JEOL 9500 E-2
|'''Condition file:''' 0.2nA_ap5,<br /> '''doses:''' 180-420 muC/cm2,<br /> '''Shot pitch:''' 7-27 nm,<br /> '''PEC:''' no <br />(27-08-2014 TIGRE)
|'''Condition file:''' 0.2nA_ap5,<br /> '''doses:''' 207-242 muC/cm2,<br /> '''Shot pitch:''' 5 nm,<br /> '''PEC:''' no <br />(02-07-2014 TIGRE)
|'''Condition file:''' 2nA_ap5,<br /> '''doses:''' 207-242 muC/cm2,<br /> '''Shot pitch:''' 5 nm,<br /> '''PEC:''' no <br />(10-04-2014 TIGRE)
|-
|-
|-style="background:WhiteSmoke; color:black"
|Develop
|Fumehood D-3
|'''Developer:''' SX-AR 600-54/6,<br /> '''time:''' 30 sec,<br /> '''Rinse:''' 30 sec in IPA<br /> (28-08-2014 TIGRE)
|'''Developer:''' SX-AR 600-54/6,<br /> '''time:''' 60 sec,<br /> '''Rinse:''' 30 sec in IPA<br /> (08-07-2014 TIGRE)
|'''Developer:''' SX-AR 600-54/6,<br /> '''time:''' 60 sec,<br /> '''Rinse:''' 60 sec in IPA<br /> (April/May-2014 TIGRE)
|-
|-
|-style="background:WhiteSmoke; color:black"
|Sputter Coat (please contact [mailto:ramona.mateiu@cen.dtu.dk Ramona Valentina Mateiu] for information )
|Cressington 208HR, DTU CEN
|3-5 nm Pt, sputtering, (29-08-2014 TIGRE)
|3-5 nm Pt, sputtering (09-07-2014 TIGRE)
|3-5 nm Pt, sputtering (22-05-2014 TIGRE)
|-
|-
|-style="background:WhiteSmoke; color:black"
|Characterization
|Zeiss SEM Supra 60VP, D-3
|'''Acc voltage:''' 3 kV, '''WD:''' < 4mm, <br />conducting tape close to pattern (29-08-2014 TIGRE)
|'''Acc voltage:''' 3 kV, '''WD:''' < 4mm, <br />conducting tape close to pattern (09-07-2014 TIGRE)
|'''Acc voltage:''' 2 kV, '''WD:''' < 4mm, <br />conducting tape close to pattern (06-06-2014 TIGRE)
|-
|}
=== SEM inspection ===
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15% |
! colspan="7" width=85% | SEM inspection of wafer 6.13, 100 nm exposed pattern, shot pitch 7 nm
|-
|-
! 300 [muC/cm2]
| [[File:6_13_100nm_300_shot14.png|200px]]
| [[File:6_13_100nm_300_shot14_Lines.png|200px]]
| [[File:6_13_100nm_300_shot14_Holes.png|200px]]
| [[File:6_13_100nm_300_shot14_Holes2.png|200px]]
| [[File:6_13_100nm_300_shot14_Pillars.png|200px]]
| [[File:6_13_100nm_300_shot14_Test.png|200px]]
! ACHK NOT READY
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; border: 3px solid #000000;"
! width=15% |
!colspan="7" width=85%|  SEM inspection of wafer 6.13, 50 nm exposed pattern, shot pitch 7 nm
|-
|-
! 270 [muC/cm2]
| [[File:6_13_50nm_270_shot14.png|200px]]
| [[File:6_13_50nm_270_shot14_Lines.png|200px]]
| [[File:6_13_50nm_270_shot14_Holes.png|200px]]
| [[File:6_13_50nm_270_shot14_Pillars.png|200px]]
| [[File:6_13_50nm_270_shot14_Holes2.png|200px]]
! ACHK NOT READY
|-
|-
! 300 [muC/cm2]
| [[File:6_13_50nm_300_shot14.png|200px]]
| [[File:6_13_50nm_300_shot14_Lines.png|200px]]
| [[File:6_13_50nm_300_shot14_Holes.png|200px]]
| [[File:6_13_50nm_300_shot14_Pillars.png|200px]]
| [[File:6_13_50nm_300_shot14_Holes2.png|200px]]
! ACHK NOT READY
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15% |
!colspan="7" width=85%| SEM inspection of wafer 6.13, 30 nm exposed pattern, shot pitch 7 nm
|-
|-
! 270 [muC/cm2]
| [[File:6_13_30nm_270_shot14.png|200px]]
| [[File:6_13_30nm_270_shot14_Lines.png|200px]]
| [[File:6_13_30nm_270_shot14_Holes.png|200px]]
| [[File:6_13_30nm_270_shot14_Pillars.png|200px]]
! ACHK NOT READY
|-
|-
! 300 [muC/cm2]
| [[File:6_13_30nm_300_shot14.png|200px]]
| [[File:6_13_30nm_300_shot14_Lines.png|200px]]
| [[File:6_13_30nm_300_shot14_Holes.png|200px]]
| [[File:6_13_30nm_300_shot14_Pillars.png|200px]]
! ACHK NOT READY
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 6.13, 20 nm exposed pattern, shot pitch 7 nm
|-
|-
! 270 [muC/cm2]
| [[File:6_13_20nm_270_shot14.png|200px]]
| [[File:6_13_20nm_270_shot14_Lines.png|200px]]
| ACHK NOT READY
|-
|-
! 300 [muC/cm2]
| [[File:6_13_20nm_300_shot14.png|200px]]
| [[File:6_13_20nm_300_shot14_Lines.png|200px]]
| ACHK NOT READY
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="6"|  SEM inspection of wafer 4.09, 50 nm exposed pattern, shot pitch 5 nm
|-
! 230 [muC/cm2]
| [[File:53nmCSAR50nmOverviewBasedose.png|250px]]
| [[File:53nmCSAR50nmLinesBasedose.png|250px]]
| [[File:53nmCSAR50nmHolesBasedose.png|250px]]
| [[File:53nmCSAR50nmPillarsBasedose.png|250px]]
| [[File:53nmCSAR50nmTestBasedose.png|250px]]
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 4.09, 30 nm exposed pattern, shot pitch 5 nm
|-
|-
! 219 [muC/cm2]
| [[File:53nmCSAR30nmOverviewBasedose-5%.png|250px]]
| [[File:53nmCSAR30nmLinesBasedose-5%.png|250px]]
| [[File:30nmShot10.png|250px]]
|-
|-
! 230 [muC/cm2]
| [[File:53nmCSAR30nmOverviewBasedose.png|250px]]
| [[File:53nmCSAR30nmLinesBasedose.png|250px]]
|
|-
|-
! 242 [muC/cm2]
| [[File:53nmCSAR30nmOverviewBasedose+5%.png|250px]]
| [[File:53nmCSAR30nmLinesBasedose+5%.png|250px]]
|
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 4.09, 20 nm exposed pattern, shot pitch 5 nm
|-
|-
! 242 [muC/cm2]
| [[File:53nmCSAR20nmOverviewBasedose+5%.png|220px]]
| [[File:53nmCSAR20nmLines2Basedose+5%.png|220px]]
|
|-
|-
! 253 [muC/cm2]
| [[File:53nmCSAR20nmOverviewBasedose+10%.png|220px]]
| [[File:53nmCSAR20nmLinesBasedose+10%.png|220px]]
|
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 3.05, 50 nm exposed pattern, shot pitch 5 nm
|-
|-
! 219 [muC/cm2]
| [[File:CSAR50nmoverview-5%.png|270px]]
| [[File:CSAR50nmlines-5%.png|270px]]
|
|-
|-
! 230 [muC/cm2]
| [[File:CSAR50nmoverview.png|270px]]
| [[File:CSAR50nmlines.png|270px]]
|
|-
|-
! 242 [muC/cm2]
| [[File:CSAR50nmoverview+5%.png|270px]]
| [[File:CSAR50nmlines+5%.png|270px]]
|
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 3.05, 30 nm exposed pattern, shot pitch 5 nm
|-
|-
! 219 [muC/cm2]
| [[File:CSAR30nmoverview-5%.png|270px]]
| [[File:CSAR30nmlines-5%.png|270px]]
|
|-
|-
! 230 [muC/cm2]
| [[File:CSAR30nmoverview.png|270px]]
| [[File:CSAR30nmlines.png|270px]]
|
|-
|-
! 242 [muC/cm2]
| [[File:CSAR30nmoverview+5%.png|270px]]
| [[File:CSAR30nmlines+5%.png|270px]]
|
|-
|}
{| class = "collapsible collapsed"  width=100% style = "border-radius: 6px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15%|
! colspan="4"|  SEM inspection of wafer 3.05, 20 nm exposed pattern, shot pitch 5 nm
|-
|-
! 230 [muC/cm2]
| [[File:CSAR20nmoverview.png|280px]]
|
|-
|-
! 242 [muC/cm2]
| [[File:CSAR20nmoverview+5%.png|280px]]
|
|-
|-
! 253 [muC/cm2]
| [[File:CSAR20nmoverview+10%.png|280px]]
|
|-
|}


== Etch Tests ==
== Etch Tests ==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/CSAR"