Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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The temperatures are accurate within approximately +/- 3C and probably underestimating the actual wafer temperature slightly. It is observed that the wafer temperature increases with each wafer, thus if wafer temperature is of concern it is advised to reduce the number of wafers per run. | The temperatures are accurate within approximately +/- 3C and probably underestimating the actual wafer temperature slightly. It is observed that the wafer temperature increases with each wafer, thus if wafer temperature is of concern it is advised to reduce the number of wafers per run. | ||
== Resistive thermal evaporation of | == Resistive thermal evaporation of Au == | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Gold/Resistive thermal evaporation of Au in Thermal Evaporator|Resistive thermal evaporation of Au in Thermal Evaporator]] | * [[Specific Process Knowledge/Thin film deposition/Deposition of Gold/Resistive thermal evaporation of Au in Thermal Evaporator|Resistive thermal evaporation of Au in Thermal Evaporator]] | ||