Jump to content

Specific Process Knowledge/Lithography/EBeamLithography/EBLsubstratePrep: Difference between revisions

← Older editNewer edit →
VisualWikitext
Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
Line 186: Line 186:


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:WhiteSmoke; color:black"
|'''AR-N 7520'''
|'''[[Specific_Process_Knowledge/Lithography/ARN7500|AR-N 7500]]'''
|Negative
|Negative
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@dtu.dk Peixiong Shi] for information.
|[https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-N7500_english_Allresist_product-information.pdf AR-N 7500 info]
|[[media:AR-N7500-7520.pdf‎|AR-N7500-7520]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]]
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|a = 17126, b = -0.435
|PGMEA
|PGMEA
|AR 300-47, TMAH
|H2O
|
|
*AR 300-47:DIW (4:1)
*MIF726:DIW (8:5)
|DIW
|
*AR 300-73
*O2 plasma
|
|


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/EBeamLithography/EBLsubstratePrep"