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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/SiO2 etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,317 edits
Line 13: Line 13:
! Wafer number !! C4F8 !! SF6 flow !! Ar !! Platen power !! Pressure
! Wafer number !! C4F8 !! SF6 flow !! Ar !! Platen power !! Pressure
|-
|-
| Y34 || Example || Example || Example || Example || Example
| Y34 || 50 sccm|| 50 sccm|| 0 sccm|| 100 W || 80 mTorr
|-
|-
| Y35 || Example || Example || Example || Example || Example  
| Y35 || Example || Example || Example || Example || Example  
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