Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/SiO2 etch: Difference between revisions
Created page with "=Etching of very thin layer of SiO2= Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop nice SiO2 recipes on this machine. Often SIO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes. The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon to avoid the recipe to become too polymerizing. So when it is used for etching..." |
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Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop nice SiO2 recipes on this machine. Often SIO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes. | Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop nice SiO2 recipes on this machine. Often SIO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes. | ||
The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon to avoid the recipe to become too polymerizing. | The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon to avoid the recipe to become too polymerizing. It is also not very uniform over the wafer, so when it is used for etching down to silicon it will also etch a lot in the silicon and in areas more than other. | ||
==Test work done== | |||
Revision as of 11:29, 25 January 2024
Etching of very thin layer of SiO2
Pegasus 3 is not meant to be used as an SiO2 etcher. Please do not develop nice SiO2 recipes on this machine. Often SIO2 etch recipes are very polymerizing and that can disturb the chamber conditions for the silicon etching recipes.
The recipe developed here is only for etching through a very thin SiO2 layer and does not have a high selectivity to silicon to avoid the recipe to become too polymerizing. It is also not very uniform over the wafer, so when it is used for etching down to silicon it will also etch a lot in the silicon and in areas more than other.