Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
| E-beam deposition of Ag | | E-beam deposition of Ag (line-of-sight, very good thickness uniformity) | ||
| Thermal deposition of Ag | | Thermal deposition of Ag (line-of-sight) | ||
| Thermal deposition of Ag | | Thermal deposition of Ag (line-of-sight, good thickness uniformity) | ||
| Sputter deposition of Ag | | Sputter deposition of Ag (some step coverage) | ||
| Sputter deposition of Ag | | Sputter deposition of Ag (some step coverage) | ||
| Sputter deposition of Ag including pulsed DC and HiPIMS | | Sputter deposition of Ag including pulsed DC and HiPIMS | ||
|- | |- | ||
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! Pre-clean | ! Pre-clean | ||
| Ar ion beam | | Ar ion etch (only in E-beam evaporator Temescal) | ||
| none | | none | ||
| none | | none | ||
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*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas | *Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas | *Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas | *Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas | *Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
|-style="background:whitesmoke; color:black" | |-style="background:whitesmoke; color:black" | ||
! Comment | ! Comment | ||
| Pumpdown approx 20 min. Possible to tilt the wafer. | | Pumpdown approx 20 min. Possible to tilt the wafer to achieve tunable step coverage. | ||
| Pumpdown approx 15 min. | | Pumpdown approx 15 min. | ||
| Only very thin layers. Pumpdown approx 1 | | Only very thin layers. Pumpdown approx 1.5 hours. | ||
| | | Pumpdown approx. 1.5 hours | ||
| | |Load and transfer < 10 minutes | ||
|Load and transfer approx. 12 minutes | |Load and transfer approx. 12 minutes | ||
|- | |- | ||