Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions

Reet (talk | contribs)
Reet (talk | contribs)
Line 14: Line 14:


==Deposition of Silicon Oxide using sputter deposition==
==Deposition of Silicon Oxide using sputter deposition==
At DTU Nanolab you can also deposit silicon oxide using the Sputter-System [[Specific Process Knowledge/Thin film deposition/Lesker|(Lesker)]] or the [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system|Sputter-System Metal Oxide(PC1)]]. An advantage here is that you can deposit on many kinds of material.
At DTU Nanolab you can sputter silicon oxide in the Sputter-System [[Specific Process Knowledge/Thin film deposition/Lesker|(Lesker)]] or the [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system|Sputter-System Metal Oxide(PC1)]]. An advantage here is that you can deposit on many kinds of material.


*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/Reactively sputtered SiO2 in Sputter-System Metal Oxide (PC1)|Reactively Sputtered Silicon Oxide in Sputter-System Metal Oxide (PC1)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/Reactively sputtered SiO2 in Sputter-System Metal Oxide (PC1)|Reactively Sputtered Silicon Oxide in Sputter-System Metal Oxide (PC1)]]