Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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*[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec in | Nickel deposition is tested occasionally, around 1-2 times per year. LabManager links require login. | ||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec in | *[http://labmanager.dtu.dk/d4Show.php?id=3736&mach=167 QC procedure for Wordentec in LabManager]<br> | ||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=167 The newest QC data for Wordentec in LabManager]<br> | |||
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*[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal in | Nickel deposition is tested occasionally, around 1 time per year. LabManager links require login. | ||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal in | *[http://labmanager.dtu.dk/d4Show.php?id=5862&mach=429 QC procedure for the Temescal in LabManager]<br> | ||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=429 The newest QC data for the Temescal in LabManager]<br> | |||
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Revision as of 12:11, 22 January 2024
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Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Labmanager Including APV and QC requires login.
Nickel deposition
Nickel can be deposited by e-beam evaporation or sputtering at DTU Nanolab. For electroplating you will have to contact other institutes at DTU, e.g., DTU Mechanical Engineering.
Some process information is available here for e-beam evaporated films:
In the chart below you can compare the different deposition equipment:
E-beam evaporation (E-beam evaporator (Temescal) and E-beam evaporator (10-pockets)) | E-beam evaporation (Wordentec) | Sputter deposition (Lesker) | Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)) | |
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General description | E-beam deposition of Nickel | E-beam deposition of Nickel | Sputter deposition of Nickel | Sputter deposition of Nickel |
Pre-clean | Ar ion etch (only in E-beam evaporator Temescal) | RF Ar clean | RF Ar clean | |
Layer thickness | 10 Å to 1 µm * | 10 Å to 1 µm * | 10 Å to 5000 Å ** | 10 Å to 5000 Å ** |
Deposition rate | 1-10 Å/s | 1-10 Å/s | Depends on process parameters, about 1 Å/s | Depends on process parameters, at least ~ 4 Å/s, see conditions here |
Batch size |
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Allowed materials |
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Almost any that does not degas. See the cross-contamination sheet. |
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Comment |
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* To deposit a cumulative thickness above 600 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine
** To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine
Quality control of e-beam evaporated Ni films
Quality control (QC) for Wordentec | ||||||||||||||||
Nickel deposition is tested occasionally, around 1-2 times per year. LabManager links require login.
Thickness is measured in 5 points with a stylus profiler. |
Quality control (QC) for the Temescal | ||||||||||||||||||
Nickel deposition is tested occasionally, around 1 time per year. LabManager links require login.
Thickness is measured in 5 points with a stylus profiler. |